San Jose, CA, May 07, 2024 (GLOBE NEWSWIRE) -- Alchip Technologies, Ltd. the high-performance ASIC leader, highlighted its recent accomplishments and future direction at its TSMC's 2024 Technology ...

APC boosts ROI through higher throughput, lower energy use, predictive maintenance and compliance, with opportunities in software services, model predictive control and hardware optimization.Dublin, ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--TSMC (TWSE: 2330, NYSE: TSM) today debuted its latest innovation in its most advanced process technology at the Company’s 2026 North America Technology Symposium.

Siemens and TSMC expand AI, 3D IC, and packaging design enablement, certifying software for advanced process technologies. At the 2025 TSMC North America Open Innovation Platform Ecosystem Forum, ...

AI-driven design solution enables circuit optimization, saving weeks of manual and iterative effort while increasing design quality. Interoperable process design kits for all advanced TSMC FinFET ...

Intel is trying to catch up with TSMC in terms of process technologies and advanced global production capacity, but when it comes to the U.S., the chip giant remains unrivalled. Intel's Fab 52 is more ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the availability of a certified node-to-node design migration flow based on the new generative AI-powered ...

New collaborations span A14 design enablement, AI-assisted engineering workflows, CoWoS® support for multi-die designs, and unified multiphysics signoff Certified EDA flows on TSMC A14 accelerate ...

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...

Successful customer tape out of HBM3 design on SF2 process and I-CubeS technology leveraged Synopsys 3DIC Compiler to reduce turnaround time by 10X. Synopsys, Inc. announced its ongoing close ...