Following through on plans the company first announced in 2004, IBM Corp. on Thursday announced that it has begun production on its totally lead-free “controlled collapse chip connection new process” ...

TOKYO, June 3, 2024 /PRNewswire/ -- Rapidus Corporation, a manufacturer of advanced logic semiconductors, and multinational technology company IBM (IBM) (NYSE: IBM), today announced a joint ...

TEMPE, Ariz., May 20, 2025 (GLOBE NEWSWIRE) -- Deca Technologies today announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s ...

(RTTNews) - Rapidus Corporation, a manufacturer of advanced logic semiconductors, and multinational technology company IBM (IBM) have joined forces to pioneer mass production technologies for chiplet ...

BILLERICA, Mass., July 5, 2012 /PRNewswire/ — TEL NEXX, Inc., a wholly owned subsidiary of Tokyo Electron U.S. Holdings, is pleased to announce a new multi-year joint development program in 3D ...

Japanese semiconductor manufacturer Rapidus is aiming to achieve mass production of 2nm chips by 2027. The company is expected to deliver its first batch of sample wafers this July and will provide ...

Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology Over the years, IBM has accumulated R&D and manufacturing technologies for ...