ASX is posting record ATM revenue and raising its LEAP outlook above $3.5B, as advanced packaging demand climbs with AI infrastructure.
Morning Overview on MSN
The world’s largest chip-assembly house just said its advanced packaging sales will double this year — the quiet bottleneck choking AI hardware
Every cutting-edge AI accelerator, whether it carries an NVIDIA, AMD, or custom hyperscaler logo, must pass through a step ...
Europe launches Tessalia Technology SAS with Foxconn, Thales and Radiall to strengthen semiconductor manufacturing and reduce ...
Launched in 2021, ISM 1.0 was conceived as a state-backed push to build a full-stack chip ecosystem. The FM announced ISM 2.0 in the 2026 Budget to produce equipment and materials, design full-stack I ...
MUMBAI, India & TOKYO & AYUTTHAYA, Thailand--(BUSINESS WIRE)-- CG Power and Industrial Solutions Limited (“CG”), a part of Tube Investments of India Limited and the Murugappa Group; Renesas ...
New High-speed Laser Marker delivers 2.5x higher chip throughput (units per hour) in a 22% smaller footprint, ...
India has approved allocating up to $15.2 billion (1.26 trillion Indian rupees) to build three new semiconductor plants, including its first semiconductor fab facility — part of the country’s big bid ...
India’s semiconduuctor roadmap targets $200B market by 2035, driving innovation, investment, and global partnerships for ...
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