Cadence Design Systems (News - Alert), Inc. has unveiled an enhanced version of its Allegro 16.6 Package Designer and System-in-Package offering. Discreet IC package necessities for next-generation ...
Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...
The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...
You just built a breadboard of your expert design. You did all the simulations needed before going to layout, and reviewed the manufacturer's suggested techniques for a good thermal design for the ...
Renewable-energy applications, as well as all kinds of energy-efficiency technologies, require reliable, compact, and thermal-efficient power devices. For driving innovation in wind turbines, smart ...
As the speeds of various SerDes interfaces move into the multi-gigabits/sec range, more ASIC chips are being designed to have multiple high speed interfaces such as USB 3.0, PCIE Gen3, DDR3, and ...
The use of FinFET devices in next-generation high-performance, low-power designs is a fundamental shift that is happening in the semiconductor industry. These devices through their smaller sizes, ...
6. SOT-23 and SOIC packages are typically used in low-power motor drivers. Standard leaded packages, like SOIC and SOT-23 packages, are often used for low-power motor drivers (Fig. 6). To maximize the ...
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