DFB laser dies bonded onto a 300mm silicon photonics wafer. imec together with Sivers Photonics (formerly CST Global, and a subsidiary of Sivers Semiconductors), and ASM AMICRA Microtechnologies ...
HSINCHU, Taiwan - eMemory and United Microelectronics Corporation today announced that eMemory’s Resistive Random Access Memory (RRAM) IP has been qualified on UMC’s 22nm ultra-low power process, ...
STMicroelectronics and GlobalFoundries announced they have signed a Memorandum of Understanding to create a new, jointly-operated 300mm semiconductor manufacturing facility adjacent to ST’s existing ...
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HSINCHU, Taiwan –TSMC today announced its 6-nanometer (N6) process, which provides a significant enhancement of its industry-leading N7 technology and offers customers a highly competitive performance ...
Accuron Technologies secures a controlling interest in Trymax Semiconductor Equipment (Trymax), a specialist in plasma-based and UV-based process equipment and solutions for semiconductor ...
Holtek announced the release of its new wireless charger transmitter Flash MCU, the HT66FW2350. The device includes a host of wireless charger transmitter required functions such as AM demodulation ...
Optimized for best conduction and switching performance in soft-switching circuits, STMicroelectronics’ STGWA40IH65DF and STGWA50IH65DF 650V STPOWER IGBTs increase the energy efficiency of resonant ...
Sensirion AG introduces the SGP - the first and only long-term stable metal-oxide gas sensor. The SGP gas sensor is based on Sensirion’s multi-pixel platform, which integrates four gas sensing ...
In recent years, in addition of popular portable devices and wearable devices, another new trend gradually emerges - smart home, from the original condition of thunder, little rain, and instead began ...
Holtek announces the release of its new Class-D amplifiers, the HT82V7524 and HT82V7534. In comparison with class A and B amplifiers,the higher efficiency of class D amplifiers allows them to provide ...