Vacuum reflow soldering technology, although limited in adoption, is emerging as a key focus in high-reliability electronics. While traditional reflow ...
Southern Manufacturing & Electronics 2026 returned to Farnborough International Exhibition & Conference Centre for its best-attended edition ...
This study investigates failures in solder joints of Ball Grid Array (BGA) components using destructive techniques such as cross-section, dye and pry, and chemical etching with metallographic reagents ...
IEEE Spectrum on MSN
How and when the memory chip shortage will end
Despite new fabs and new technology, prices will stay high ...
As electronic products move from prototyping to mass production, manufacturers must rely on efficient, scalable, and ...
Abstract: Low Temperature Solders (LTS), typically Sn-Bi alloys, are increasingly being adopted in surface mount technology (SMT) assembly due to their ability to reduce warpage during assembly by ...
Soldering frequently involves hunching in and squinting at the fiddly task at hand, or performing that task under an unmoving magnifying glass. The D01 Visual Soldering Iron offers a more versatile ...
The Governing Board is comprised of one President, two Vice-Presidents, and seven Members-at-Large. They are joined by the Chairperson and First Vice-Chairperson of the IPC Athletes' Council and two ...
Abstract: A solder interconnect fatigue life model was developed by Werner Engelmaier in the early 1980s as an improvement upon the inelastic strain range-based Coffin-Manson model. As developed, the ...
Strong problem-solving and analytical skills. Excellent communication and collaboration abilities. Proven ability to work independently and as part of a globally distributed team. Familiarity with ...
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