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TSMC Lifts Arizona to $265 Billion After Record Quarter: Four Fabs Target AI Packaging Bottleneck

TSMC Arizona investment reached $265 billion as the world's largest contract chipmaker posted its fifth consecutive record ...
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Cadence Launches AI Super Agent for PCB, Packaging Design

Cadence launches AuraStack AI Super Agent on Allegro AI Studio platform to automate PCB and advanced packaging design ...
Tech Times on MSN

Sakana Fugu adds Nemotron to prove open models can route past proprietary walls

Sakana AI and NVIDIA have joined forces to add Nemotron 3 Ultra — the most capable open-weight model from a US lab — to ...
Tech Times on MSN

Iran strikes Bandar Abbas infrastructure as IMF confirms global disinflation has stalled

Strait of Hormuz oil fell to two-month lows Friday as U.S. strikes hit Bandar Abbas bridges and a port control tower while ...