If organizations want their learning and development efforts to produce results, they need to redesign the infrastructure ...
In today’s advanced packages, however, resistance no longer resides primarily inside transistors or neatly bounded test ...
Generic AI tools weren't designed for learning. The future belongs to purpose-built, pedagogically informed tools with ...
Abstract: Through silicon via (TSV) technology has been widely employed as a promising 3-D packaging technology to achieve significant reduction in device dimensions. Due to the existence of ...
Existing technology is being upcycled and deployed in new ways as companies seek to measure more data, more accurately.
Abstract: Given the ubiquity of power electronic converter (PEC) systems, they often represent the weakest link in terms of reliability within modern power and energy systems in different applications ...
In fact, some of the most reliable German cars ever made wear the BMW roundel. Think the 1990 BMW 325is (E30), 1998 BMW M5 ...