DFB laser dies bonded onto a 300mm silicon photonics wafer. imec together with Sivers Photonics (formerly CST Global, and a subsidiary of Sivers Semiconductors), and ASM AMICRA Microtechnologies ...
HSINCHU, Taiwan - eMemory and United Microelectronics Corporation today announced that eMemory’s Resistive Random Access Memory (RRAM) IP has been qualified on UMC’s 22nm ultra-low power process, ...
STMicroelectronics and GlobalFoundries announced they have signed a Memorandum of Understanding to create a new, jointly-operated 300mm semiconductor manufacturing facility adjacent to ST’s existing ...
HSINCHU, Taiwan –TSMC today announced its 6-nanometer (N6) process, which provides a significant enhancement of its industry-leading N7 technology and offers customers a highly competitive performance ...
Holtek announced the release of its new wireless charger transmitter Flash MCU, the HT66FW2350. The device includes a host of wireless charger transmitter required functions such as AM demodulation ...
Accuron Technologies secures a controlling interest in Trymax Semiconductor Equipment (Trymax), a specialist in plasma-based and UV-based process equipment and solutions for semiconductor ...
【Taipei , Taiwan】 Synopsys announced Laker custom design solutions have adopted by TSMC 16 nm FinFET Design Rule Manual (DRM) 0.5 version certification, and will also be included in the TSMC 16 nm ...
Optimized for best conduction and switching performance in soft-switching circuits, STMicroelectronics’ STGWA40IH65DF and STGWA50IH65DF 650V STPOWER IGBTs increase the energy efficiency of resonant ...
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Sensirion AG introduces the SGP - the first and only long-term stable metal-oxide gas sensor. The SGP gas sensor is based on Sensirion’s multi-pixel platform, which integrates four gas sensing ...
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