Abstract: One of the key requirements for mass production of die-to-wafer Cu bonding is preventing copper surface oxidation. In this study, Cu bonding utilizing an Ag nanolayer was examined to achieve ...
Abstract: In many real-life situations in engineering (and in other disciplines), we need to solve an optimization problem: we want an optimal design, we want an optimal control, etc. One of the main ...
This study investigates the microstructural and crystallographic changes in a novel Nb-enhanced, Ti-reduced maraging steel. The hot-rolled steel was solution annealed at two different temperatures ...
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