New optical chip design controls light speed in real time, simulations suggest

Seoul National University College of Engineering announced that a joint research team led by Professor Namkyoo Park and ...
PlasticsToday

Cadence Launches AI Super Agent for PCB, Packaging Design

Cadence launches AuraStack AI Super Agent on Allegro AI Studio platform to automate PCB and advanced packaging design ...
Semiconductor Engineering

Optimizing The Nano-TSV-to-BPR Connection In Backside Power Networks

A realistic virtual model uncovers the impact of rounded corners on sensitivity to overlay-induced resistance.

Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging

Cadence (Nasdaq: CDNS) today introduced the AuraStack™ AI Super Agent on Cadence® Allegro® AI Studio, the world’s first agentic AI platform for printed circuit board (PCB) and advanced packaging ...

Cadence extends its AI agents beyond chips with AuraStack for circuit boards and packaging

Integrated circuit and electronic hardware design company Cadence Design Systems Inc. today announced a new artificial ...

Cadence Expands AI Agents With AuraStack For PCB And Advanced Chip Packaging

Cadence believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just ...
IEEE

Enhancing Equivalent Circuit Simulation of Intrinsic Josephson Junction Stacks Using Modularization of LTspice Elements

Abstract: We have developed a construction method of equivalent circuits for an intrinsic Josephson junction stack using the modularization feature in LTspice. This method improves the readability of ...
IEEE

Real-Time Simulation of Complex 4D Wind Fields and Gusts for UAS Control System Development

Abstract: This article describes a new suite of simulation plugins for the Gazebo 3D simulator to facilitate realistic simulation of time-varying 3D wind fields and gusts. The plugins integrate with ...